TEAHA

The European Application Home Alliance

Project Manager: ir. Hans Scholten

Faculty of Electrical Engineering, Mathematics and Computer Science - EEMCS

Tel.: +31 53 489 3733

Email: j.scholten@utwente.nl

Project website: http://wwwhome.cs.utwente.nl/~scholten/research-teaha.html

Project Summary

The European Application Home Alliance (TEAHA) addresses networked home control applications and their complementarity to A/V networked applications. Its objective is to work with the A/V world to specify an open, secure, interoperable and seamless global home platform.

The TEAHA initiative has been structured into two phases. Phase 1 is this project. Phase 2 will involve a significant test programme.

TEAHA approach is to define a suitable middleware platform that will allow the seamless interworking of the wide variety of appliances found in a home environment, from the 3 cent device to the 300 eu device, over the wide variety of network solutions from the 100bit/s to the 100mbit/s.

Research and innovation work is foreseen on an open middleware framework to ensure interoperability across heterogeneous networks, on new network 'independent service discovery and security mechanisms, on low-cost RF components supporting TEAHA middleware based on advanced RFCMOS technology, on an ultra low-cost powerline communication in order to achieve less than 0.5 euro communication cost allowing the connection of virtually any household small appliance and on new residential gateway components.

The route to industrial deployment will be addressed through the validation of three applications: white goods control, energy management, and residential gateway applications with seamless integration with networked A/V applications. Then standardisation work will be carried out. Finally marketing and dissemination will involve preparing TEAHA phase 2.

TEAHA publications UT

Project duration: 3 years

Project budget: 5 M-€ / 2.5 M-€ funding

Number of person/years: 31 fte

Project Coordinator: Telefónica I+D

Participants:

·

Technology and semiconductor partners :
Ikerlan, SHARP,Trialog, Wrap, SIGMA,Advantica, KONNEX

·

Research partners :
K.U. Leuven, University of Twente

·

Telcos and utilities :
Telefonica, EDF

·

Consumer goods :
Philips UK, Fagor

Project budget CTIT: 370.1 k-€ / 185.1 k-€ funding

Number of person/years CTIT: 2.6 fte

Involved groups: Distributed and Embedded Systems (DIES)

CTIT Strategic Research Orientation: UBRICKS (Building Blocks for Ubiquitous Computing and Communication)